NarinpatSu.
New Member
- Messages
- 1
Hello i'm university student in Thailand. And I do research about reducing waste in the manufacturing process. Process is nickel-chromium plating in cap fuel.
Flow Process is
1. Semi-bright nickel 4 times 2.5mins/times
- Nickel Sulphate 280 g/L
- Nickel Chloride 40 g/L
- Boric Acid 45 g/L
- Ni 2110 12 cc/l
- Ni 2100 0.1 cc/l
- Ni 2120 0.5 cc/l
- Wetting Agent 2 cc/l
2. Dip in water 2.5 mins
3. High Nickel sulphure 2.5 mins
- Nickel Sulphate 300 g/L
- Nickel Chloride 88 g/L
- Boric Acid 36 g/L
- Tri - Strike 15cc/l
4. Dip in water 2.5 mins
5. bright Nickel 4 times 2.5mins/times
- Nickel Sulphate 280 g/L
- Nickel Chloride 40 g/L
- Boric Acid 65 g/L
- Ni 2720 4 cc/l
- Ni 2700 0.6 cc/l
- Ni 2710 4 cc/l
- Wetting Agent 2 cc/l
6.dip in water 4 times 2.5mins/times
7. dip in CR –Activator 5-10 %
8.Chrome 6+ 2.5 mins
- Chromic Acid 200 g/l
- Sulfuric Acid 0.54 g/l
- Additive AG 20 cc/l
- Additive BF 20 cc/l
Every step are continuous flow
Now, I think that peeling and poor adhesion problem occur from nickel to nickel (semi bright to bright layer of nickel, and bright nickel to chrome layer. But I don't know that problems are come from more.
And I have Questions ,everybody would answer me, please.
1.What's method I can examine the peeling from what layer?
2.Peeling problem occur most of between layers?
3.What cause of the peeling problem from ? I want to know both nickel to nickel (semi bright to bright layer of nickel, and bright nickel to chrome layer
4.And what's solution about that? I want to know both nickel to nickel (semi bright to bright layer of nickel, and bright nickel to chrome layer
between plating bright nickel to chrome layer have dip in water 2.5 . It have effect to peeling problem?
Thanks in Advance.
Flow Process is
1. Semi-bright nickel 4 times 2.5mins/times
- Nickel Sulphate 280 g/L
- Nickel Chloride 40 g/L
- Boric Acid 45 g/L
- Ni 2110 12 cc/l
- Ni 2100 0.1 cc/l
- Ni 2120 0.5 cc/l
- Wetting Agent 2 cc/l
2. Dip in water 2.5 mins
3. High Nickel sulphure 2.5 mins
- Nickel Sulphate 300 g/L
- Nickel Chloride 88 g/L
- Boric Acid 36 g/L
- Tri - Strike 15cc/l
4. Dip in water 2.5 mins
5. bright Nickel 4 times 2.5mins/times
- Nickel Sulphate 280 g/L
- Nickel Chloride 40 g/L
- Boric Acid 65 g/L
- Ni 2720 4 cc/l
- Ni 2700 0.6 cc/l
- Ni 2710 4 cc/l
- Wetting Agent 2 cc/l
6.dip in water 4 times 2.5mins/times
7. dip in CR –Activator 5-10 %
8.Chrome 6+ 2.5 mins
- Chromic Acid 200 g/l
- Sulfuric Acid 0.54 g/l
- Additive AG 20 cc/l
- Additive BF 20 cc/l
Every step are continuous flow
Now, I think that peeling and poor adhesion problem occur from nickel to nickel (semi bright to bright layer of nickel, and bright nickel to chrome layer. But I don't know that problems are come from more.
And I have Questions ,everybody would answer me, please.
1.What's method I can examine the peeling from what layer?
2.Peeling problem occur most of between layers?
3.What cause of the peeling problem from ? I want to know both nickel to nickel (semi bright to bright layer of nickel, and bright nickel to chrome layer
4.And what's solution about that? I want to know both nickel to nickel (semi bright to bright layer of nickel, and bright nickel to chrome layer
between plating bright nickel to chrome layer have dip in water 2.5 . It have effect to peeling problem?
Thanks in Advance.
but welcome anyway, I hope someone with knowledge on this topic comes along soon.